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System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery
System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery
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机译:用于插座和封装电源/接地排的系统和装置,以增加载流能力,以实现更高的IC功率输出
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摘要
A socket and package apparatus are disclosed for increasing the amount of power that can be delivered from an IC board to an IC where the IC package is mounted in a socket connected to the IC board. In one embodiment, the IC package includes a first power plane along with a power carrier and one or more pin receptacles. The power bar carrier includes a first conducting panel that is electrically coupled to the first power plane along a first adjacent edge. The first conducting panel is also electrically coupled to a first plurality of conducting pads.
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