首页> 外国专利> METHOD OF FORMING A THREE-DIMENSIONAL MICROSTRUCTURE ON THE SURFACE, ITS APPLICATION, AND SO RECEIVED MICROSTRUCTURED PRODUCTS

METHOD OF FORMING A THREE-DIMENSIONAL MICROSTRUCTURE ON THE SURFACE, ITS APPLICATION, AND SO RECEIVED MICROSTRUCTURED PRODUCTS

机译:在表面上形成三维微观结构的方法,其应用以及所获得的微观结构产品

摘要

A method of forming a three-dimensional microstructure on a flat surface of the base, comprising applying the first flat and uniform layer (2) of silicone onto the specified surface of the base (1) and applying to the first layer of silicone a second three-dimensionally microstructured layer (3) of silicone, with the first layer and the second layer of silicone become seamlessly connected in order to create in this way a common three-dimensional microstructure, which provides anti-adhesive properties evenly distributed over the substrate surface, so that any flexible surface substrate, in particular a surface of adhesive deposited on said layers of silicone will be microstructured by inverse playback three-dimensional microstructure formed by the two layers of silicone, said layers of silicone are fixed by curing by heating or under UV or electron irradiation, or a combination thereof; its use and films, in particular self-adhesive films, such as films microstructured by this method.
机译:一种在基底的平坦表面上形成三维微观结构的方法,包括将第一平坦且均匀的硅树脂层(2)施加到基底(1)的指定表面上,然后将第二层有机硅施加到第一层硅树脂上硅酮三维三维结构层(3)与硅酮的第一层和第二层无缝连接,从而以这种方式创建通用的三维微观结构,该结构提供了均匀分布在基材表面的抗粘特性,以使任何柔性表面基材,特别是沉积在所述有机硅层上的粘合剂表面,都可以通过由两层有机硅层形成的反向回放三维微结构而微结构化,所述有机硅层通过加热固化或紫外线或电子辐射,或其组合;它的用途和薄膜,特别是自粘薄膜,例如通过此方法微结构化的薄膜。

著录项

  • 公开/公告号EA200601255A1

    专利类型

  • 公开/公告日2006-12-29

    原文格式PDF

  • 申请/专利权人 МАКТАК ЮРОП С.А.;

    申请/专利号EA20060001255

  • 发明设计人 СТОК РОБЕРТ ГИСЛЕН;

    申请日2005-01-03

  • 分类号B29C59/02;B29C35/08;B29C59/04;B29D11;B32B37;C09J7/02;

  • 国家 EA

  • 入库时间 2022-08-21 20:59:02

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