A LEAD FREE SOLDER INTERCONNECT STRUCTURE FOR ELECTRONIC PACKAGE INTERCONNECTIONS

摘要

: A lead free solder hierachy structure for electronic packaging that includes organic interposers (50). The assembly may also contain passive components (100) as well as underfill material (80). The lead free solder hierachy also provides a lead free solder solution for the attachment of a heat sink (75) to the circuit chip (10) with a suitable lead free solder alloy.e assembly may also