A LEAD FREE SOLDER INTERCONNECT STRUCTURE FOR ELECTRONIC PACKAGE INTERCONNECTIONS

摘要

A lead free solder hierarchy struct1;lre for electronic packaging that includes organic interposers (50). The assembly may also contain passive components (100) as well as underfill material (80). The lead free solder hierarchy also provides a lead free solder solution for the attachment of a heat sink (75) to the circuit chip (10) with a suitable lead free solder alloy.