首页> 外国专利> A PROCESS FOR DEPOSITING ELECTRONIC CERAMIC OXIDE THIN FILMS WITH CONTROLLED OXYGEN STOICHIOMETRY ON DIFFERENT SUBSTRATE MATERIALS

A PROCESS FOR DEPOSITING ELECTRONIC CERAMIC OXIDE THIN FILMS WITH CONTROLLED OXYGEN STOICHIOMETRY ON DIFFERENT SUBSTRATE MATERIALS

机译:用受控氧化学计量法在不同基质材料上沉积电子陶瓷氧化物薄膜的方法

摘要

1. A process for coating electronic ceramic oxide thin films of materials on substrates such as, Si, Si with buffered layers (Pt/TiCVSiCVSi), lanthunum aluminate, platinized MgO and ytteria stabilized zirconia comprising, (a), providing a single phase pure film forming material in a dense disc form at the target position for laser ablation and the said substrate at appropriate distance from the said target in a pulse laser deposition chamber; (b). depositing a thin film of the said film forming material on the said substrate kept in the said pulse laser deposition chamber maintaining the said substrate temperature at 400 - 750 °C and oxygen at 0.1 to 1.0 torr; (c). flooding the said pulse laser deposition chamber with oxygen and allowing to cool it to room temperature on attaining the required thickness of the said thin film.
机译:1.一种在诸如Si,具有缓冲层(Pt / TiCVSiCVSi),铝酸镧,镀铂的MgO和稳定的氧化锆的衬底上的诸如Si,Si的衬底上涂覆材料的电子陶瓷氧化物薄膜的方法,包括:(a)提供纯的单相在脉冲激光沉积室中,在用于激光烧蚀的目标位置处的致密盘状成膜材料和距所述目标适当距离的所述衬底; (b)。在保持在所述脉冲激光沉积室中的所述基板上沉积所述成膜材料的薄膜,所述基板将所述基板温度保持在400-750℃,将氧气保持在0.1-1.0托。 (C)。在达到所述薄膜所需厚度的同时,向所述脉冲激光沉积室注入氧气并使其冷却至室温。

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