A HIGH-PERFORMANCE FIN CONFIGURATION FOR AIR-COOLED HEAT DISSIPATION DEVICE

摘要

AN ENHANCED HEAT DISSIPATION SYSTEM AND A METHOD TO EXTRACT HEAT FROM AN INTEGRATED CIRCUIT DEVICE INCLUDES A THERMALLY CONDUCTIVE CORE (210) HAVING UPPER AND LOWER OUTER SURFACE AREAS (230,240).THE SYSTEM FURTHER INCLUDES A FIRST CONDUCTIVE RING (220) HAVING A FIRST ARRAY OF RADIALLY EXTENDING FINS (250). THE FIRST CONDUCTIVE RING (220) IS THERMALLY COUPLED TO THE UPPER OUTER SURFACE AREA (230).THE THERMALLY CONDUCTIVE CORE (210) INCLUDES THE FIRST ARRAY AND THE LOWER OUTER SURFACE AREA (240) AREA OF SUFFICIENT SIZE TO ALLOW COMPONENTS ON A MOTHERBOARD (130) ENCROACH ON TO THE INTEGRATED CIRCUIT DEVICE WHEN THE HEAT DISSIPATION DEVICE (200) IS MOUNTED ON TO THE INTEGRATED CIRCUIT DEVICE.(FIG 2)