Method and device for conditioning semiconductor wafers and / or hybrids.

摘要

Procedure for packaging films and / or hybrid semiconductor, comprising the steps of: preparing a space (1) which is at least partially enclosed and has a support device wafer / hybrid (10) is located inside and it has the purpose of supporting a sheet and / or hybrid semiconductor; and conducting a dry fluid through the support device wafer / hybrid (10) for heat treating the support device wafer / hybrid (10); wherein at least a portion of the fluid leaving the support device wafer / hybrid (10) is used to condition the atmosphere within the space (1).