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INTEGRATED APPROACH FOR DESIGN, SIMULATION AND VERIFICATION OF MONOLITHIC, SILICON-BASED OPTO-ELECTRONIC CIRCUITS

机译:基于硅的单芯片光电电路的设计,仿真和验证的集成方法

摘要

Computer-aided design (CAD) tools are used to perform the integrated design, verification and layout of electrical and optical components in a monolithic, silicon-based electro-optic chip. Separate top-level behavioral logic designs are prepared for the three different types of elements included within the final, silicon-based monolithic structure: 1) digital electronic integrated circuit elements (12); 2) analog/mixed signal electronic integrated circuit elements (14); and 3) opto-electronic elements (16) (including passive and active optical elements). Once the behavioral logic design is completed, the results are combined and co-simulated (18). physical layout design is developed and verified for each different type of element in the circuit. The separate physical layouts are then co-verified (26), to assess the properties of the overall physical design. The results of the co-simulation (18) are compared to t results of the co-verification (26), with alterations made in the logic design and/or the physical layout until the desired operating parameters are obtained. Once the desired results are generated, conventional wafer-level fabrication operations are then considere to provide a final product ("tape out").
机译:计算机辅助设计(CAD)工具用于在单片硅基电光芯片中执行电气和光学组件的集成设计,验证和布局。为最终的基于硅的单片结构中包括的三种不同类型的元素准备了单独的顶层行为逻辑设计:1)数字电子集成电路元素(12); 2)模拟/混合信号电子集成电路元件(14); 3)光电元件(16)(包括无源和有源光学元件)。一旦行为逻辑设计完成,就将结果合并并共同仿真(18)。针对电路中每种不同类型的元件开发并验证了物理布局设计。然后对单独的物理布局进行共同验证(26),以评估总体物理设计的属性。将共同仿真的结果(18)与共同验证的结果(26)进行比较,在逻辑设计和/或物理布局上进行更改,直到获得所需的操作参数为止。一旦产生期望的结果,然后考虑常规的晶片级制造操作以提供最终产品(“卷带”)。

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