POSITIVE RESIST COMPOSITION FOR FORMATION OF THICK RESIST FILM, THICK RESIST LAMINATE, AND METHOD FOR FORMATION OF RESIST PATTERN

摘要

Disclosed is a positive resist composition for use in the formation of a thick resist film having a film thickness of 1 to 15 μm. The composition comprises a resin component (A) whose alkali solubility can be increased by the action of an acid and an acid generator component (B) which can generate an acid when exposed to light, both dissolved in an organic solvent (S). In the composition, the organic solvent (S) is a mixture of 10 to 95% by mass of propylene glycol monomethyl ether and 5 to 90% by mass of another solvent (S2).