POSITIVE RESIST COMPOSITION FOR THICK FILM RESIST FILM FORMATION, THICK FILM RESIST LAMINATE, AND RESIST PATTERN FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a positive resist composition for thick film resist film formation capable of forming a thick film resist pattern with good profile, a thick film resist laminate and a resist pattern forming method.;SOLUTION: The positive resist composition for thick film resist film formation in a film thickness of 1-15 μm contains a resin component (A) containing a high molecular compound (A1) which has a constitutional unit (a1) derived from hydroxystyrene and a constitutional unit (a2) derived from an acrylic ester containing an acid-dissociable dissolution inhibiting group, and which has a mass average molecular weight of 20,000-50,000, an acid generator component (B) which contains an onium salt type acid generator having an anionic moiety represented by formula (I): R^4"SO₃^-, and which generates an acid upon exposure, and a nitrogen-containing organic compound (D) containing a tertiary aliphatic amine, wherein R^4" represents a 4C linear or branched alkyl or fluoroalkyl group.;COPYRIGHT: (C)2007,JPO&INPIT