Surfactants for use in supercritical carbon dioxide, method for improving the efficiency of cleaning of the various microelectronic structures with carbon dioxide fluid

摘要

The present invention is applicable to environmentally friendly carbon dioxide POEGMA ((oligo (ethylene glycol) methacrylate)) - PFOMA (perfluorooctylmethacrylate) and PDMAEMA ((dimethyl amino) ethyl methacrylate)) - PFOMA (perfluorooctylmethacrylate) relates to semiconductor manufacture and the cleaning and prevention using the same pattern collapse of the copolymer surfactant. The above-described surfactant as the parent carbon dioxide PFOMA component (CO ₂ philic) the characteristics, POEGMA or holding lypophilic the hydrophilic properties and, at the same time as one component, so PDMAEMA be applied to carbon dioxide to further improve the cleaning power there. Specifically, in the present invention, a copolymer that contains a small ATRP carbon dioxide component and a parent component (Atom Transfer Radical Polymerization), the GTP (Group Transfer Polymerization) or easily prepared using a radical polymerization. Surfactants of this invention is good to the properties of absorbing water, various substrates used in conjunction with liquid or supercritical carbon dioxide, for example a semiconductor substrate, the micro-composite element mechanism (MEMs), a display panel or a photoelectric element (optoelectronic device), etc. from contaminants, such as water, and is effective in removing the water-soluble solvent (developer), and an ionic by-product, does not give any damage to the substrate. Accordingly, the present invention provides the use of a variety of electronic POEGMA-PFOMA or PDMAEMA-PFOMA of the invention useful in removing contaminants of the substrate copolymer surfactants using a carbon dioxide fluid.