BALL GRID ARRAY PACKAGE PREVENTING A DELAMINATION DEFECT

摘要

detachment fault the suppression of BGA (Ball Grid Array, under 'BGA') package in about initiating. To this end, the present invention has a slit in the center as a printed circuit board having a first side and a second side, the circuit side to the first surface of the printed circuit board is bonded, the bond pads in the central portion of the pad relocation pattern form and , and the semiconductor chip is lower than the elastic modulus of the pad relocation pattern in the form of bond pads of the outermost insulating film above the other film or the sealing resin in the semiconductor chip, the bond with the second surface of the bonding pad and the printed circuit board of the semiconductor chip and wires that connect the fingers, the bond pad region of the semiconductor chip, and a sealing resin for sealing the slit, and a wire for a printed circuit board, characterized in that it comprises a solder ball attached to the solder ball pads on the second surface of the printed circuit board provide a BGA package that suppresses the peeling defect of.