TEST CIRCUIT FOR MULTI CHIP PACKAGE CONTAINING SENSOR CHIP, AND MULTI CHIP PACKAGE CONTATINING THE TEST CIRCUIT

摘要

The invention comprises a multi-test circuit and the test circuit for a multi-chip package including a sensor chip relates to a chip package, it can be confirmed that there is a connection between the sensor chip and the other circuit chip (chip). The test circuit of the present invention is to supply power to a predetermined pattern that is connected to the sensor chip, and disconnection of the bonding (bonding) between the voltage outputted by reading the resistance is distributed by the sensor chip and the sensor chip circuit chip (open) Status is determined. Through this, it can be confirmed that there is a connection between the sensor chip and the like in a multi-chip package comprising a passive element that can not be resolved through the logical function test sensor chip and the neighboring chip in a simple way. These tests are being complicated in order to conduct the entire test item or function, such as a previous test each logic circuit such that it takes a long time, and can significantly reduce the test time, the multi-chip package, it is possible to simplify the production process, production cost can reduce the