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AMONIA SUPPLY DEVICE EQUIPPED FLOW METER AND AMONIA FLOW DETECTING METHOD

机译:装有氨气的设备的流量计及氨气流量的检测方法

摘要

The present invention is whether the ammonia used for the cleaning of the semiconductor wafer manufacturing process, the injection nozzle which relates to the flow of ammonia to be supplied and the ammonia flow sensing device is provided sensing method meth. ; The chemical mechanical polishing of semiconductor manufacturing process as one method that is applied to the process of planarization of the wafer process (Chemical mechanical polishing : hereinafter "CMP" referred to) has a ; The use of ammonia to remove impurities of the rough surface of the wafer CMP process ; However, a problem with the flow of ammonia the problem of future devices that can not detect the presence of a large amount of the wafer is a defect in the wafer pass generation was not performed if the result is normal washing. ; This invention is in the ammonia supply flow line meta, meta install the flow control unit, the display device is effective to detect whether or not there is a problem with the flow of ammonia.
机译:发明内容本发明的目的是提供一种用于清洁半导体晶片制造工序的氨,与要供给的氨的流量相关的喷射喷嘴以及氨流量感测装置。 ;作为应用于晶片的平坦化工序(化学机械研磨:以下称为“ CMP”)的一种方法,半导体制造工序的化学机械研磨具有以下特征:利用氨水去除晶片CMP工艺的粗糙表面杂质;然而,如果结果是正常洗涤,则氨的流动问题,不能检测到大量晶片的存在的未来装置的问题是晶片通过的产生中的缺陷,如果结果是正常洗涤则不进行。 ;本发明是在氨供给流路meta,meta上安装流量控制单元的显示装置,可有效地检测出氨的流量是否有问题。

著录项

  • 公开/公告号KR20070051574A

    专利类型

  • 公开/公告日2007-05-18

    原文格式PDF

  • 申请/专利权人 DONGBU ELECTRONICS CO. LTD.;

    申请/专利号KR20050109320

  • 发明设计人 CHA HYUN KI;

    申请日2005-11-15

  • 分类号H01L21/304;

  • 国家 KR

  • 入库时间 2022-08-21 20:35:02

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