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MAGNETRON SPUTTER ELECTRODE AND SPUTTERING APPARUTUS USING THE MAGNETRON SPUTTER ELECTRODE
MAGNETRON SPUTTER ELECTRODE AND SPUTTERING APPARUTUS USING THE MAGNETRON SPUTTER ELECTRODE
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机译:磁控溅射电极和使用该磁控溅射电极的溅射装置
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摘要
A magnetron sputter electrode and a sputtering apparatus using the same are provided to adjust easily a tunnel-shaped magnetic flux profile generated between a magnet assembly and a magnet. A magnetron sputter electrode includes a target(41) and a magnet assembly installed at a backside of the target. The magnet assembly is formed by arranging a central magnet(52) and a peripheral magnet on a supporting plate(51) for forming tunnel-shaped magnetic flux in front of the target. The supporting plate including the central magnet and the peripheral magnet is divided into both facing sides. A position change unit fixes a center part of the divided facing sides on a base plate(54).
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