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MAGNETRON SPUTTER ELECTRODE AND SPUTTERING APPARUTUS USING THE MAGNETRON SPUTTER ELECTRODE

机译:磁控溅射电极和使用该磁控溅射电极的溅射装置

摘要

A magnetron sputter electrode and a sputtering apparatus using the same are provided to adjust easily a tunnel-shaped magnetic flux profile generated between a magnet assembly and a magnet. A magnetron sputter electrode includes a target(41) and a magnet assembly installed at a backside of the target. The magnet assembly is formed by arranging a central magnet(52) and a peripheral magnet on a supporting plate(51) for forming tunnel-shaped magnetic flux in front of the target. The supporting plate including the central magnet and the peripheral magnet is divided into both facing sides. A position change unit fixes a center part of the divided facing sides on a base plate(54).
机译:提供磁控溅射电极和使用该磁控溅射电极的溅射装置,以容易地调节在磁体组件和磁体之间产生的隧道形磁通量分布。磁控溅射电极包括靶(41)和安装在靶背面的磁体组件。该磁铁组件是通过在支承板(51)上配置中央磁铁(52)和外周磁铁而在靶的前方形成隧道状的磁通而形成的。包括中心磁体和外围磁体的支撑板被划分为两个相对侧。位置改变单元将分开的相对侧的中心部分固定在基板(54)上。

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