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ELECTROCHEMICAL DEPOSITION OF TANTALUM AND/OR COPPER IN IONIC LIQUIDS
ELECTROCHEMICAL DEPOSITION OF TANTALUM AND/OR COPPER IN IONIC LIQUIDS
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机译:离子液体中钽和/或铜的电化学沉积
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摘要
The invention relates to a method for electrochemical deposition of tantalum and/or copper on a substrate in an ionic liquid, containing at least one tetraalkylammonium-, tetraalkylphosphonium-, 1,1-dialkylpyrrolidinium-, 1-hydroxyalkyl-1-alkylpyrrolidinium-, 1-hydroxyalkyl-3-alkylimidazolium-or bis(1-hydroxyalkyl)imidazolium cation, whereby the alkyl groups or the alkylene chains of the 1-hydroxyalkyl groups can independently have 1 to 10 C atoms.
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