MEMORY MODULE HAVING A COOLING MEANS, METHOD FOR PRODUCING THE MEMORY MODULE HAVING A COOLING MEANS, AND DATA PROCESSING DEVICE COMPRISING A MEMORY MODULE HAVING A COOLING MEANS

摘要

A memory module having a cooling unit, a method for producing the memory module having the cooling unit, and a data processing device including a memory module with the cooling unit are provided to avoid overheated memory modules by improving heat dissipation from the memory modules by enabling improved air flowing between adjacent memory modules. A memory module(100) includes a board with a surface(2) where at least one first electronic component and at least one second electronic component, and a cooling element(210) having a first section(214) with a first end part(216), which is arranged on the surface of the board and extended in a first direction, and a second end part(217) which is extended in a first direction. At least one or more stabilizing elements(211,212) are arranged to be extended in the first direction to the first end part and the second end part of the first section of the cooling element. The cooling element has a second section(215). The cooling element has a surface(213) spaced from the surface of the board. The surface(213) of the first section of the cooling element is away from a first distance(D1) from the surface of the board. The surface(213) of the first section of the cooling element is away from a second distance(D2) from the surface of the board, and the first distance and the second distance are different from each other.