Memory module, with a means for the cooling, a method for the production of the memory module with a means for cooling as well as a data processing apparatus comprising a memory module, with a means for the cooling

摘要

The memory module (100) with a means for cooling comprises a printed circuit board (1) with a surface (2), on which at least a first electronic component (4) and at least a second electronic component (5) are arranged, on the surface (3) of the circuit board (1) which is arranged in the cooling element (210) with a first portion (214), which a is in a first direction (x) extending first end (216) and a is in the first direction (x) extending second end (217) comprises. In each case on the first end (216) and at the second end (217) of the first section (214) of the cooling element (210) is at least one is in the first direction (x) extending stabilizing element (211, 212) is arranged. The cooling element has, furthermore, (210) a second portion (215) and a of the surface (2) of the circuit board (1) on the surface facing away from (213). The surface (213) of the first section (214) of the cooling element (210) has a first distance (d1) of the surface (2) of the circuit board (1) and the surface (213) of the second section (215) of the cooling element (210) has a second distance (d2) of the surface (2) of the circuit board (1), wherein the first distance (d1) and the second distance (d2) are different.