首页>
外国专利>
PALLADIUM-GOLD PLATING PROCESS TO SOLVE A LARGE THICKNESS DISTRIBUTION ON HIGH DENSITY PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD PRODUCED THEREFROM
PALLADIUM-GOLD PLATING PROCESS TO SOLVE A LARGE THICKNESS DISTRIBUTION ON HIGH DENSITY PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD PRODUCED THEREFROM
展开▼
机译:解决高密度印刷电路板和印制电路板印刷电路板上大厚度分布的钯金镀覆工艺
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention relates to a plating method for solving the thickness deviation of plating, which occurs in a high-density printed circuit board, and a printed circuit board produced thereby. This invention features that a first porous palladium (Pd) plating layer is formed on an exposed soldering portion and a wire-bonding portion of the printed circuit board, which is made of copper or copper alloy, by means of a substitution plating method, a secondary palladium or palladium alloy plating layer is formed on the first plating layer by means of an electroless reduction plating method, and then a gold (Au) or gold alloy plating layer is precipitated and formed on the second plating layer by means of the substitution plating method using the difference of ionization tendency.
展开▼