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Method of forming transistor using the step shallow trench isolation profile in a nand flash memory device

机译:在nand闪存器件中使用阶梯状浅沟槽隔离轮廓形成晶体管的方法

摘要

invention step STI (Shallow Trench Isolation) profile (Profile) using the NAND flash memory device of the transistor relates to a method of forming , after forming a spacer on both side walls STI , to carry out step by forming a step STI STI etch profile , as well as to secure a wide active width , to improve the transistor performance of the cell area and the peripheral area there . As a result , the chip size is reduced to reduce the cost (cost), to improve the cell current and improve program speed . And after forming the STI step profile , by an annealing process , it is possible to prevent the thinning (thinning) is generated in the oxide film in the vicinity of a corner (corner) of the oxidation process step STI edge (edge).
机译:使用晶体管的NAND闪存器件的发明步骤STI(浅沟槽隔离)轮廓(轮廓)涉及在两个侧壁STI上形成间隔物之后形成步骤STI STI蚀刻轮廓以形成步骤的方法。以及确保较宽的有效宽度,以改善单元区域和外围区域的晶体管性能。结果,减小了芯片尺寸以降低成本(成本),以改善单元电流并提高编程速度。并且,在形成STI台阶轮廓之后,通过退火工艺,可以防止在氧化工艺步骤STI边缘(边缘)的拐角(角)附近的氧化膜中产生变薄(变薄)。

著录项

  • 公开/公告号KR100729923B1

    专利类型

  • 公开/公告日2007-06-18

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20050027298

  • 发明设计人 허현;

    申请日2005-03-31

  • 分类号H01L21/8247;

  • 国家 KR

  • 入库时间 2022-08-21 20:31:56

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