Wafer level chip scale package for Image sensor module and manufacturing method thereof and camera module using the same

摘要

A wafer level chip scale package for an image sensor module, a manufacturing method thereof, and a camera module using the same are provided to minimize a height thereof and foreign material by manufacturing the wafer level chip scale package using a dummy substrate having solder balls. A wafer level chip scale package(100) for an image sensor module includes an image sensor(110), a dummy substrate(120), an IR(Infrared Ray) filter glass(130), solder balls(140), and a printed circuit board. The image sensor(110) includes a light receiving part(111) formed on the center thereof. The dummy substrate(120) is adhered on an upper part of the image sensor(110) and includes a window cavity(122) and a plurality of vias(121). The window cavity(122) is formed on the dummy substrate(120). The plurality of vias are formed on the dummy substrate(120) around the window cavity(122). The IR filter glass(130) is coupled to the dummy substrate(120) in order to uncover an area of the window cavity(122). The solder balls(140) are formed outside the IR filter glass(130) on the dummy substrate(120). An under fill is formed around the solder balls(140) for reinforcing a coupling of the solder balls(140) and the printed circuit board.