Conditioner for a polishing pad used in chemical mechanical polishing used in the manufacturing of semiconductor devices, comprising a substrate with uniform geometric protrusions on one side covered by a diamond layer

摘要

A ceramic disc-shaped substrate is formed with geometrical protrusions of a uniform height on at least one side. A cutting portion (22) is formed, with a diamond layer of a uniform thickness formed on all the surface of the side of the substrate with protrusions. The protrusions have a flat upper surface, or the upper surface may comprise several smaller protrusions formed by recessed grooves. The cutting portion makes line and surface contacts with the polishing pad surface. An independent claim is included for a method of manufacturing a conditioner for a polishing pad.