首页> 外国专利> Method for production of communicating hollow spaces, involves providing silicon substrate in which first mask and second mask are brought whereby two differently porous layers in silicon substrate are produced by electrochemical corroding

Method for production of communicating hollow spaces, involves providing silicon substrate in which first mask and second mask are brought whereby two differently porous layers in silicon substrate are produced by electrochemical corroding

机译:用于产生连通的中空空间的方法,包括提供硅衬底,在该硅衬底中引入第一掩模和第二掩模,从而通过电化学腐蚀在硅衬底中制造两个不同的多孔层。

摘要

Method involves providing silicon substrate in which first mask and second mask are brought. Two differently porous layers in the silicon substrate are produced by electrochemical corroding. The highly porous silicon layer relocates itself forming first hollow space covered by epitaxial film. A third mask is applied on the epitaxial film. The epitaxial film is structured by corroding so a second hollow space is created. The second cavity is covered by applying a further layer on the epitaxial film which can be taken off.
机译:该方法涉及提供其中具有第一掩模和第二掩模的硅衬底。硅基底中的两个不同的多孔层是通过电化学腐蚀产生的。高度多孔的硅层自身重新定位,形成被外延膜覆盖的第一中空空间。在外延膜上施加第三掩模。通过腐蚀来构造外延膜,从而形成第二中空空间。通过在可去除的外延膜上施加另一层覆盖第二腔。

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