Method for correcting the shape of a thinly polished wafer used during semiconductor manufacture comprises coating the water with a liquid after polishing, drying, hardening and applying tensile stress to the wafer by contraction

摘要

Method for correcting the shape of a thinly polished wafer (1) comprises coating the water with a liquid after polishing, drying, hardening and applying tensile stress to the wafer by contraction. An independent claim is also included for a device for correcting the shape of a wafer comprising a nozzle (2) for applying the liquid and a heater and/or dryer (3).