Semiconductor chip and production processes has adhesive-free three layer metallization with aluminum layer, diffusion blocking layer and diffusion solder layer

摘要

A semiconductor chip (1) comprises an adhesion layer -free three layer metallization comprising an aluminum layer (4) directly on the chip, followed by a diffusion-blocking layer (5) and directly, by a solder layer (6). The diffusion-blocking layer comprises titanium, nickel, platinum or chromium and the solder layer comprises diffusion solder. All three layers are applied by sputtering. Independent claims are also included for production processes for the above chip.