Epoxy resin system, useful in encapsulation or assembly of optoelectronic element, comprises epoxy containing first component comprising epoxy resin and a second component comprising an acid anhydride and acid ester of carboxylic acid

摘要

Epoxy resin system comprises an epoxy containing A-component comprising at least an epoxy resin as first epoxy component, where the epoxy resin is cycloaliphatic and aliphatic epoxy resin and is obtained through distillation; a B-component comprising at least an acid anhydride of cycloaliphatic and aliphatic, saturated carboxylic acid and their mixture, at least an acid ester of carboxylic acid, at least an organic Zn 2 + complex compound and at least a organophosphorus compound. Independent claims are included for: (1) an epoxy resin molding material obtained through hardening of the epoxy resin system at a glass transition temperature of at least 125[deg]C; (2) an optoelectronic element arranged with an element in the optical path and comprising the epoxy resin molding material, for the radiation transparent encapsulation; (3) a method for the preparation of an epoxy resin molding material, comprising mixing the A- and B-component of the epoxy resin system with one another and hardening the obtained mixture; and (4) a method for the encapsulation of optical element comprising pouring a volume of arranged optical element with the epoxy resin system by reel-to-reel method.