首页>
外国专利>
Method for manufacturing quasi-substrate wafer, which is used in manufacturing semiconductor body, involves connecting epitaxial growth substrate wafer with auxiliary support wafer
Method for manufacturing quasi-substrate wafer, which is used in manufacturing semiconductor body, involves connecting epitaxial growth substrate wafer with auxiliary support wafer
展开▼
机译:用于制造半导体本体的准衬底晶片的制造方法包括将外延生长衬底晶片与辅助支撑晶片连接。
展开▼
页面导航
摘要
著录项
相似文献
摘要
The method involves connecting an epitaxial growth substrate wafer (1) with an auxiliary support wafer (4). A main surface (101) of the epitaxial growth substrate wafer points at the auxiliary support wafer. A component opposite to the auxiliary support wafer of the epitaxial growth substrate wafer is separated along the separating area (2) out of sight of the separating area.
展开▼