首页> 外国专利> MANUFACTURING METHOD OF SEMICONDUCTOR WAFER FOR EPITAXIAL GROWTH, SEMICONDUCTOR WAFER FOR EPITAXIAL GROWTH, AND MANUFACTURING METHOD OF SEMICONDUCTOR EPITAXIAL WAFER

MANUFACTURING METHOD OF SEMICONDUCTOR WAFER FOR EPITAXIAL GROWTH, SEMICONDUCTOR WAFER FOR EPITAXIAL GROWTH, AND MANUFACTURING METHOD OF SEMICONDUCTOR EPITAXIAL WAFER

机译:用于表皮生长的半导体晶片的制造方法,用于表皮生长的半导体晶片的制造方法以及用于表皮半导体晶片的制造方法

摘要

To provide a manufacturing method of a semiconductor wafer for epitaxial growth capable of maintaining hydrogen at a high concentration in a surface portion of the semiconductor wafer and can have strong gettering.SOLUTION: A manufacturing method of a semiconductor wafer for epitaxial growth according to the present invention includes a first step of irradiating the surface of the semiconductor wafer with cluster ions containing carbon and hydrogen as constituent elements to form a modified layer and a second step of irradiating the semiconductor wafer with electromagnetic waves after the first step and performing heat treatment for recovering crystallinity on the semiconductor wafer, and in the first step, a part of the modified layer in the thickness direction is an amorphous layer, and in the second step, a recrystallized single crystal layer is formed while maintaining an amorphous state in a part of the deep portion.SELECTED DRAWING: Figure 1
机译:提供一种用于外延生长的半导体晶片的制造方法,该方法能够在半导体晶片的表面部分保持高浓度的氢并且具有强的吸杂剂。解决方案:根据本发明的用于外延生长的半导体晶片的制造方法本发明包括第一步,用含碳和氢作为构成元素的簇离子辐照半导体晶片的表面,以形成改性层;第二步,第一步之后,用电磁波辐照半导体晶片,并进行热处理以回收半导体晶片。在第一步骤中,在厚度方向上的一部分改性层是非晶层,在第二步骤中,在保持部分非晶态的同时形成再结晶的单晶层。图1

著录项

  • 公开/公告号JP2019004034A

    专利类型

  • 公开/公告日2019-01-10

    原文格式PDF

  • 申请/专利权人 SUMCO CORP;

    申请/专利号JP20170117135

  • 发明设计人 KADONO TAKESHI;KURITA KAZUNARI;

    申请日2017-06-14

  • 分类号H01L21/265;H01L21/322;H01L21/268;H01L21/20;

  • 国家 JP

  • 入库时间 2022-08-21 12:19:11

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