Semiconductor or sensor arrangement for use in soldered housing, has surfaces soldered in region and connected with board in another region, where former region lying proximate at structure to be contacted is thicker than latter region

摘要

The arrangement has contact surfaces (2), which are not holohedrally soldered, where the contact surfaces are firmly soldered with a section of a conductive strip (5) in a surface region (7) and are not firmly connected with a printed circuit board in a surface region (10). The surface region (7) lying at a semiconductor or sensor structure to be contacted is thicker than the surface region (10), which is not connected with the printed circuit board.