Connection contact unit for connecting electrical conductor to circuit carrier, has selective-soldering and surface mount device-soldering-regions, where sections connected with carrier and conductor are designed as regions, respectively

摘要

The contact unit (10) has a selective-soldering-region (12) and a surface mount device (SMD)-soldering-region (18), where a section connected with a circuit carrier is designed as the region (12), and another section connected with an electrical conductor is designed as the region (18). The region (12) has a Y-shaped overlay for the conductor, and has a recess (16) below the conductor overlay, and the contact unit is designed in U-shape.