Semiconductor component, has polymer foam layer filling interspace between upper side of semiconductor chips and wiring structure of wiring substrate, where edge sides of chips and edge sides of layer are surrounded by housing in substrate

摘要

Component (1) has flip chip contacts (3) arranged on an active upper side of semiconductor chips (2). The contacts are embedded in a polymer foam layer (4), which has a closed porous material. The foam layer fills an interspace between the upper side of the chips and a wiring structure (7) of a wiring substrate (8). The edge sides of the chips and the edge sides of the foam layer are surrounded by a housing in the wiring substrate. The foam layer has a hydrocyclic polymer e.g. polyimide or a polyphenylquinoxaline or polybenzhydrolimide, as a stable component. An independent claim is also included for: a method of manufacturing a semiconductor component.