首页> 外国专利> Magnetoresistive transitions` forming method for use in magnetoresistive RAM cell production process, involves structuring mask layers to produce hard masks, removing polymer residues from masks, and etching structure of transition layers

Magnetoresistive transitions` forming method for use in magnetoresistive RAM cell production process, involves structuring mask layers to produce hard masks, removing polymer residues from masks, and etching structure of transition layers

机译:用于磁阻RAM单元生产过程中的磁阻过渡区的形成方法,涉及构造掩模层以生产硬掩模,从掩模中去除聚合物残留物以及蚀刻过渡层的结构

摘要

The method involves depositing one of hard mask layers (6) on an etch blocking layer, and structuring and etching the mask layers for production of hard masks, so that the etching of the etch blocking layer is blocked. Polymer residues are removed from the hard masks and the etch blocking layer is etched. A layer structure of the magnetoresistive transition layers is etched for production of a magnetoresistive transition (13). The material of the etch stopping layer is selected from a group of ruthenium (Ru), tantalum nitrate (TaN) and tungsten nitrate (WN).
机译:该方法包括在蚀刻阻挡层上沉积硬掩模层(6)之一,并且对掩模层进行结构化和蚀刻以制造硬掩模,从而阻挡蚀刻阻挡层的蚀刻。从硬掩模上去除聚合物残留物,并蚀刻蚀刻阻挡层。蚀刻磁阻过渡层的层结构以产生磁阻过渡(13)。蚀刻停止层的材料选自钌(Ru),硝酸钽(TaN)和硝酸钨(WN)。

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