首页> 外国专利> Thermal insulation tile has thermal conductivity of no more than 0.27 W(m-K), preferably no more than 0.26 W(m-K) and no less than 0.22 W(m-K), preferably no less than 0.24 W(m-K)

Thermal insulation tile has thermal conductivity of no more than 0.27 W(m-K), preferably no more than 0.26 W(m-K) and no less than 0.22 W(m-K), preferably no less than 0.24 W(m-K)

机译:隔热瓦的导热率不大于0.27W(m-K),优选不大于0.26W(m-K)且不小于0.22W(m-K),优选不小于0.24W(m-K)

摘要

The thermal insulation tile (1) consists of a fired tile material with a number of vertical holes (2) and at least two butting surfaces (3,4) with teeth. The fired tile material has a thermal conductivity of no more than 0.27 W(m-K), preferably no more than 0.26 W(m-K) and a thermal conductivity of no less than 0.22 W(m-K), preferably no less than 0.24 W(m-K). An independent claim is also included an unfired semifinished product for an inventive device.
机译:隔热瓦(1)由具有多个垂直孔(2)和至少两个带有齿的对接表面(3,4)的烧结瓦材料组成。烧制的瓷砖材料的热导率不大于0.27W(mK),优选不大于0.26W(mK),并且热导率不小于0.22W(mK),优选不小于0.24W(mK)。 。独立权利要求还包括用于本发明装置的未烧制的半成品。

著录项

  • 公开/公告号DE202006012748U1

    专利类型

  • 公开/公告日2006-11-23

    原文格式PDF

  • 申请/专利权人 SCHLAGMANN BAUSTOFFWERKE GMBH & CO. KG;

    申请/专利号DE202006012748U1

  • 发明设计人

    申请日2006-08-18

  • 分类号E04C1/00;

  • 国家 DE

  • 入库时间 2022-08-21 20:29:05

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