Self-assembly microstructure with polyimide thin-film elastic joint

摘要

The self-assembly microstructure includes a photosensitive polyimide elastic joint 52 between stationary 50 and movable 51 parts. The polyimide elastic joint 52 contracts during a high temperature reflow process. The surface tension of the cured polyimide rotates and lifts-up the movable part 51 of the microstructure. The formation process is also claimed. The microstructure can be a micro-fan.