RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PREPREG, INSULATION BOARD WITH SUPPORTING BASE, LAMINATE AND MULTILAYERED PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for printed circuit boards, prepreg, insulation material with supporting base, laminate and multilayered printed circuit board.;SOLUTION: The resin composition for printed circuit boards comprises an aqueous medium, an emulsion resin dispersed in the aqueous medium. The emulsion resin contains a filler. The emulsion resin contains an epoxy resin. The emulsion resin contains a cyanate resin.;COPYRIGHT: (C)2008,JPO&INPIT