FORMING METHOD FOR COPPER PARTICULATE SINTERED BODY TYPE MICRO PROFILE CONDUCTIVE BODY AND FORMING METHOD FOR COPPER MICRO PROFILE WIRING AND COPPER THIN FILM USING SAME METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a copper particulate sintered body type micro profile conductive body showing excellent conductivity by applying a reduction treatment to the copper particulates or oxidized copper particulates provided with a surface oxidized film layer in a pattern under comparatively low temperature after a detailed pattern is drawn by using dispersion liquid of copper particulates provided with surface oxidized film layers and then sintering the formed copper particulates.;SOLUTION: The process is carried out in a series of heat treatment processes such that the particulates in a coating layer are, for example, heated to temperature which is 200°C or more and 300°C or less under a pressurizing condition of 1.5 atmospheric pressure or more in an environment containing hydrogen molecules after the dispersion liquid containing copper particulates with the surface oxidized film layer or oxidized copper particulates with an average particle diameter of 1 to 100 nm is coated on a substrate, and are subjected to a reduction reaction of the oxidized film using hydrogen molecules as a reducing agent, to form the sintered body layer between the copper particulates obtained.;COPYRIGHT: (C)2008,JPO&INPIT