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CLAY-LIKE COMPOSITION FOR FORMING SINTERED COPPER BODY, POWDER FOR CLAY-LIKE COMPOSITION FOR FORMING SINTERED COPPER BODY, METHOD OF MANUFACTURING CLAY-LIKE COMPOSITION FOR FORMING SINTERED COPPER BODY, SINTERED COPPER BODY, AND METHOD OF MANUFACTURING SINTERED COPPER BODY
CLAY-LIKE COMPOSITION FOR FORMING SINTERED COPPER BODY, POWDER FOR CLAY-LIKE COMPOSITION FOR FORMING SINTERED COPPER BODY, METHOD OF MANUFACTURING CLAY-LIKE COMPOSITION FOR FORMING SINTERED COPPER BODY, SINTERED COPPER BODY, AND METHOD OF MANUFACTURING SINTERED COPPER BODY
A clay-like composition for forming a sintered copper body of the present invention includes a powder constituent containing a copper-containing metal powder which contains copper and a copper-containing oxide powder which contains copper; a binder; and water, wherein the amount of oxygen contained in the powder constituent is in a range of from 4 mass % to 8 mass %.
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