首页> 外国专利> REFLOW FURNACE, DEVICE FOR CONTROLLING OXYGEN CONCENTRATION, METHOD FOR CONTROLLING OXYGEN CONCENTRATION IN FURNACE, PROGRAM FOR CONTROLLING OXYGEN CONCENTRATION, AND RECORDING MEDIUM STORING PROGRAM FOR CONTROLLING OXYGEN CONCENTRATION

REFLOW FURNACE, DEVICE FOR CONTROLLING OXYGEN CONCENTRATION, METHOD FOR CONTROLLING OXYGEN CONCENTRATION IN FURNACE, PROGRAM FOR CONTROLLING OXYGEN CONCENTRATION, AND RECORDING MEDIUM STORING PROGRAM FOR CONTROLLING OXYGEN CONCENTRATION

机译:回流炉,控制氧气浓度的装置,控制炉中氧气浓度的方法,控制氧气浓度的程序以及记录用于控制氧气浓度的介质存储程序

摘要

PROBLEM TO BE SOLVED: To provide a reflow furnace capable of reducing the supply cost of an inactive gas.;SOLUTION: The reflow furnace 105 soldering a part on a printed-circuit board 30 contains a control section 20 inputting the state of a solder material from a solder material state detector detecting the state of the solder material related to a soldering. The control section 20 controls valves 14 and 15 in response to the input solder material state and controls an oxygen concentration in the furnace.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种能够减少惰性气体的供应成本的回流炉;解决方案:在印刷电路板30上焊接部件的回流炉105包括输入焊料材料状态的控制部分20。从焊料状态检测器检测与焊接有关的焊料状态。控制部分20响应于所输入的焊料材料状态来控制阀14和15,并控制炉中的氧气浓度。;版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008112822A

    专利类型

  • 公开/公告日2008-05-15

    原文格式PDF

  • 申请/专利权人 OMRON CORP;

    申请/专利号JP20060294132

  • 发明设计人 HORINO MASANOBU;OHASHI KATSUMI;

    申请日2006-10-30

  • 分类号H05K3/34;B23K1/00;B23K1/008;B23K31/02;B23K101/42;

  • 国家 JP

  • 入库时间 2022-08-21 20:24:24

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