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EPITAXIAL SUBSTRATE FOR MBE, AND METHOD FOR FORMING III-V COMPOUND SEMICONDUCTOR FILM USING MBE METHOD
EPITAXIAL SUBSTRATE FOR MBE, AND METHOD FOR FORMING III-V COMPOUND SEMICONDUCTOR FILM USING MBE METHOD
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机译:MBE的基体,以及使用MBE方法形成III-V复合半导体膜的方法
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摘要
PROBLEM TO BE SOLVED: To provide an epitaxial substrate for an MBE method for depositing a III-V compound semiconductor film with the use of the MBE method.;SOLUTION: The epitaxial substrate 11 for the MBE includes: a III-V compound semiconductor single crystal wafer 13 such as GaAs, InP; and a homoepitaxial film 15 having the surface 15a for depositing the III-V compound semiconductor film with the use of the MBE method. A carbon density, an oxygen density, and a silicon density in an interface 17 between the semiconductor single crystal wafer 13 and the homoepitaxial film 15 are respectively less than 4×1018/cm3, less than 1×1018/cm3, and less than 4×1018/cm3. Before the deposition of the III-V compound semiconductor film 17 with the MBE method, forming the homoepitaxial film 15 on a polished surface 13a of the semiconductor single crystal wafer 13 reduces a dependency of an optical characteristic of the III-V compound semiconductor film 17 on the presence of a chemical etching process on the main surface of the wafer.;COPYRIGHT: (C)2008,JPO&INPIT
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机译:解决的问题:提供一种MBE方法的外延衬底,该MBE方法利用MBE方法沉积III-V族化合物半导体膜。解决方案:MBE的外延衬底11包括:III-V族化合物半导体单层晶体晶片13,例如GaAs,InP;具有表面15a的同质外延膜15,该表面用于通过MBE法沉积III-V族化合物半导体膜。半导体单晶晶片13和同质外延膜15之间的界面17中的碳密度,氧密度和硅密度分别小于4×10 18 Sup> / cm 3 < / Sup>,小于1&times; 10 18 Sup> / cm 3 Sup>,并且小于4&times; 10 18 Sup> / cm 3 晚餐>。在通过MBE方法沉积III-V族化合物半导体膜17之前,在半导体单晶晶片13的抛光表面13a上形成同质外延膜15可以减小III-V族化合物半导体膜17的光学特性的依赖性。晶圆主表面上存在化学蚀刻工艺的研究;版权所有:(C)2008,JPO&INPIT
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