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EVALUATING SUBSTRATE OF THERMOELECTRIC MATERIAL, AND PACKAGE/COLLECTIVE EVALUATION DEVICE FOR THE THERMOELECTRIC MATERIAL
EVALUATING SUBSTRATE OF THERMOELECTRIC MATERIAL, AND PACKAGE/COLLECTIVE EVALUATION DEVICE FOR THE THERMOELECTRIC MATERIAL
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机译:评估热电材料的基质以及热电材料的包装/集体评估设备
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摘要
PROBLEM TO BE SOLVED: To arrange a larger number of thermoelectric samples on a multilayer wiring board, with respect to a limited number of probes of a measuring instrument.;SOLUTION: An evaluating substrate of a thermoelectric material includes the multilayer wiring board, wherein a plurality of the electrode terminals are formed so as to be exposed to the upper surface of the multilayer wiring board, and a plurality of the electrode pads formed to the peripheral part of the upper surface of the multilayer wiring board are connected by a plurality of the wiring patterns formed in a layer, and a plurality of thermoelectric material thin-film pieces formed on the upper surface of the multilayer wiring board, in contact with the electrode terminals and is constituted so that a plurality of the electrode terminals, formed on the upper surface of the multilayer wiring board constitute a plurality of electrode units, each of which has at least a pair of the electrode first terminals and the thermoelectric material thin-film pieces are formed on the electrode units. Two adjacent first electrode terminals are constituted of a common electrode in between two adjacent electrode units, and the common electrode is connected to one of a plurality of the electrode pads by a single wining pattern.;COPYRIGHT: (C)2008,JPO&INPIT
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