NON-CYANOGEN TYPE ELECTROLYTIC GOLD PLATING BATH FOR BUMP FORMATION

摘要

PROBLEM TO BE SOLVED: To provide a non-cyanogen type electrolytic gold plating bath capable of attaining sufficient film hardness for covering the reduction of the reliability that, when a gold bump is joined with a mating substrate or the like, it is collapsed by pressure-sticking force and is widen, so as to cause a short-circuit.;SOLUTION: The non-cyanogen type electrolytic gold plating bath for bump formation comprises: a gold source composed of the alkali salt of gold sulfite or ammonium gold sulfite; a stabilizer composed of water soluble amine, a crystal regulator, conducting salts composed of a sulfite and a sulfate; and a buffer; and further comprises: polyalkylene glycol and/or an amphoteric surfactant. The bath comprises polyalkylene glycol with the average molecular weight of 300 to 900 by 1.5 to 20 g/L, or comprises polyalkylene glycol with the average molecular weight of 900 to 10,000 by ≥0.01 g/L and also comprises an amphoteric surfactant by 0.1 to 1,000 mg/L.;COPYRIGHT: (C)2008,JPO&INPIT