The Purity of Gold Plating in theMicroelectronic Packages and the Impurities in the Plating Bath

摘要

The demand of gold plating of microelectronic packaging in MIL is briefly introduced in the paper. The effect which the codeposition or entrainment of the impurities in the plating bath can bring on the structure and property of gold plating is analysed. It emphsized that the diminishing of the plating solution contamination and the enhancement of the gold plating purity are important to improve the quality of microelectronics packages.