NON-CYANOGEN TYPE ELECTROLYTIC GOLD PLATING BATH FOR BUMP FORMING

摘要

assignment ; Suppressing the expansion of the plating material of the mask opening, and provides a bicyclic sight electrolytic gold plating bath which can form a bump or a wiring of a designed dimension and the dimension is not a big difference. ; It means to resolve ; Geumwon (金 源) and sulfite gold alkali salt or a sulfite gold ammonium as, the water-soluble amine as a stabilizer (stabilizer), crystal control agent and, and as sulfite and sulfate conductive salt, buffering agents and polyalkylene glycol and / or amphoteric surfactants Vichy bumps sight for containing the electrolytic gold plating bath. The blending amount of the polyalkylene glycol is 0.1㎎ ~ 10g / L are preferred, and the amount of amphoteric surfactant is preferably in the 0.1㎎~1g / L. Amphoteric surfactants may be preferably used as a carboxy betaine.