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MICROSWITCHING ELEMENT AND MICROSWITCHING ELEMENT MANUFACTURING METHOD

机译:微开关元件和微开关元件的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a microswitching element suitable for suppressing orientation variations of a movable contact electrode to a fixed contact electrode, and a manufacturing method of the microswitching element.;SOLUTION: The element X1 is provided with a fixed part 11, a movable part 12, an electrode 13 having contact parts 13a', 13b', an electrode 14A having a contact part 14a to contact the contact part 13a', and an electrode 14B having a contact part 14b' to be opposed to the contact part 13b'. The manufacturing method comprises a process to form the electrode 13 on a substrate, a process to form a sacrifice layer on the substrate so as to cover the electrode 13, a process to form a first recessed part and a second recessed part shallower than this at the positions corresponding to the electrode 13 in the sacrifice layer, a process to form the electrode 14A to fill the first recessed part having a portion to be opposed to the electrode 13 through the sacrifice layer, and a process to form an electrode 14B to fill the second recessed part having a portion to be opposed to the electrode 13 through the sacrifice layer, and a process to remove the sacrifice layer.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种微开关元件,该微开关元件适合于抑制可动接触电极相对于固定接触电极的取向变化;以及该微开关元件的制造方法。解决方案:元件X1设有固定部11,可动部12,具有接触部13a’,13b’的电极13,具有与接触部13a’接触的接触部14a的电极14A,以及与接触部13b相对的接触部14b’的电极14B。 '。该制造方法包括在基板上形成电极13的工序,在基板上形成覆盖电极13的牺牲层的工序,形成比其浅的第一凹部和第二凹部的工序。在牺牲层中与电极13相对应的位置,形成电极14A以填充具有通过牺牲层与电极13相对的部分的第一凹入部分的工艺,以及形成电极14B以填充的工艺第二凹陷部分具有通过牺牲层与电极13相对的部分,以及去除牺牲层的工艺。版权所有:(C)2008,JPO&INPIT

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