FLEXIBLE WIRING BOARD ADHESIVE COMPOSITION, FLEXIBLE WIRING BOARD COVER LAY, AND FLEXIBLE WIRING BOARD WITH ELECTROMAGNETIC WAVE SHIELD LAYER
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机译：柔性接线板粘合剂组合物，柔性接线板覆盖层和带电磁波屏蔽层的柔性接线板
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摘要
PROBLEM TO BE SOLVED: To provide a flexible wiring board adhesive composition that is extremely excellent in sliding/bending characteristics and can be also excellent in adhesion, heat resistance, flame resistance, and elecromagnetic wave shield characteristics.;SOLUTION: The flexible wiring board adhesive composition including (A) polyepoxide, (B) epoxy resin curing agent, (C) elastomer, (D) inorganic filler other than silver powder, and (E) silver powder as essential components, wherein of the (E) component, specific surface area is 0.5 m2/g or more and 1.5 m2/g or less, tap density is 2.5 g/cm3 or more and 7.0 g/cm3 or less, and mean diameter is 0.1 μm or more and 20 μm or less, and the content of the silver powder in the (E) component in the flexible wiring board adhesive composition is 65 wt.% or more and 95 wt.% or less.;COPYRIGHT: (C)2008,JPO&INPIT
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机译：要解决的问题：提供一种具有优异的滑动/弯曲特性并且还具有优异的粘合性，耐热性，阻燃性和电磁波屏蔽特性的挠性电路板粘合剂组合物;解决方案：挠性电路板粘合剂组合物，其包含（A）聚环氧化物，（B）环氧树脂固化剂，（C）弹性体，（D）除银粉以外的无机填充剂和（E）银粉作为必要成分，其中（E）成分中的比表面面积为0.5 m 2 / g以上且1.5 m 2 / g以下，振实密度为2.5 g / cm 3 以上且7.0g / cm 3 以下，平均直径为0.1μm以上且20μm以下，并且挠性配线中的（E）成分中的银粉的含量板粘合剂的组成为65 wt。％或更多且95 wt。％或以下。;版权所有：（C）2008，JPO＆INPIT
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