ADHESIVE COMPOSITION FOR FLEXIBLE WIRING BOARD, COVER-LAY, ADHESIVE FILM, FLEXIBLE COPPER-CLAD LAMINATE, FLEXIBLE WIRING BOARD AND WIRING BOARD WITH STIFFENING PLATE EACH USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition for a flexible wiring board which can improve the high temperature sliding and bending performance of the board when it is used for producing a flexible wiring board and also has good adhesion, heat resistance, and flame retardancy.;SOLUTION: The adhesive composition comprises (A) a polyepoxide compound, (B) an curing agent for an epoxy compound, and (C) a styrene/butadiene/methyl methacrylate triblock copolymer as essential components. The size of the structure of the component (C) is 60-5,000 nm. The component (C) is contained in an amount of 1-30 pts.wt. based on 100 pts.wt. of the component (A).;COPYRIGHT: (C)2008,JPO&INPIT