FILM CARRIER TAPE, SEMICONDUCTOR ASSEMBLY, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, MOUNTING BOARD, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide film carrier tape, a semiconductor assembly, a semiconductor device for which CSP technology is applied, and the method of manufacturing the same, a mounted board, an electronic apparatus and to provide a technology that does not require solder resist to be applied to the surface.;SOLUTION: The semiconductor device that does not require solder resist to be applied to the surface has: leads 54 formed on one surface of a polyimide film 10; external connection terminals 11 formed on the leads 54 to project from the other surface of the polyimide film 10 through via holes 30; and an IC chip 15 adhered to the first surface. Thus, the leads 54 are covered by the IC chip 15, and the application of solder resist can be omitted.;COPYRIGHT: (C)2008,JPO&INPIT