PLATING PRETREATMENT METHOD AND APPARATUS FOR CITY WATER MADE OF LEAD-CONTAINING COPPER ALLOY

摘要

PROBLEM TO BE SOLVED: To provide a plating pretreatment method where lead or the like dissolved in an etching liquid is not electrodeposited (restuck) to a lead-containing copper alloy as the object to be plated even without adding a chelating agent forming an insoluble inert coupled product.;SOLUTION: A lead-containing copper alloy as the object to be plated is dipped into an alkaline etching liquid to which a chelating agent of forming an insoluble inert coupled product is not added, and, in such a state, electrolysis where the lead-containing copper alloy is used as either a positive pole or a negative pole, and electrolysis where the lead-containing copper alloy is used as the other positive pole or negative pole are alternately performed (PR electrolysis).;COPYRIGHT: (C)2008,JPO&INPIT