METHOD FOR SUPPLYING LIQUID BONDING MATERIAL, METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD, DEVICE FOR SUPPLYING LIQUID BONDING MATERIAL, AND LIQUID BONDING MATERIAL

摘要

PPROBLEM TO BE SOLVED: To supply liquid bonding material not to overflow due to wet spreading even if a land for supplying liquid bonding material is minute. PSOLUTION: The method for supplying a liquid bonding material comprises a step (B) for preparing a liquid bonding material where charged particles 60 produced by coating metal particles 62 with an insulating resin material 64 and charging the insulating resin material 64 are dispersed into an insulating solvent and supplying that liquid bonding material toward the land 72 of a substrate while condensing by electrostatic force generated between the land 72 and a predetermined liquid supply apparatus, a step (C) for mounting the electrode 74 of an electronic component on the land 72 of the substrate, and reflow steps (D, E) for dissolving the insulating resin material 64 and the metal particles 62 wherein the land 72 of the substrate is connected electrically and physically with the electrode 74 of the electronic component. PCOPYRIGHT: (C)2008,JPO&INPIT